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| FDC6330L February 1999 FDC6330L Integrated Load Switch General Description This device is particularly suited for compact power management in portable electronic equipment where 3V to 20V input and 2.3A output current capability are needed. This load switch integrates a small N-Channel power MOSFET (Q1) which drives a large P-Channel power MOSFET (Q2) in one tiny SuperSOTTM-6 package. Features *V DROP DROP V = 0.2V @ V = 12V, I =2.5 A. R = 0.08 IN L (ON) = 0.2V @ V = 5V,I = 1.6 A. R = 0.125 . IN L (ON) * Control MOSFET (Q1) includes Zener protection for ESD ruggedness (>6kV Human Body Model). * High performance PowerTrenchTM technology for extremely low on-resistance. * SuperSOTTM-6 package design using copper lead frame for superior thermal and electrical capabilities. Applications * Power management * Load actuation Vin,R1 4 Q2 3 Vout,C1 EQUIVALENT CIRCUIT ON/OFF 5 Q1 2 Vout,C1 IN VDR OP + - OUT R1,C1 6 See Application Circuit 1 R2 ON/OFF SuperSOT -6 Absolute Maximum Ratings Symbol V IN V ON/OFF ID PD T J , T stg ESD Input Voltage Range On/Off Voltage Range Load Current - Continuous - Pulsed Maximum Power Dissipation o TM TA=25 C unless otherwise noted Parameter (Note 1) Ratings 3 - 20 1.5 - 8 (Note 2) Units V V A W C kV 2.3 10 0.7 -55 to +150 6 (Note 1) Operating and Storage Temperature Range Electrostatic Discharge Rating MIL-STD-883D Human-Body-Model (100pf/1500 Ohm) Thermal Characteristics R JA R JC Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case (Note 2) (Note 2) 180 60 C/W C/W Package Marking and Ordering Information Device Marking Device FDC6330L Reel Size 7'' Tape width 8mm Quantity 3000 units .330 ( . Denotes pin 1) (c)1999 Fairchild Semiconductor Corporation FDC6330L Rev. C FDC6330L Electrical Characteristics Symbol Parameter TA=25 C unless otherwise noted o Test Conditions Min Typ Max Units OFF Characteristics IFL Leakage Current (Note 3) VIN = 20 V, VON/OFF = 250 A 1 A ON Characteristics VDROP R(ON) IL Conduction Voltage Q2 - Static On-Resistance Load Current VIN = 12 V, VON/OFF = 3.3 V, IL = 2.5 A VIN = 5 V, VON/OFF = 3.3 V, IL = 1.6 A VGS = -12 V, ID = -2.3 A VGS = -5 V, ID = -1.9 A VDROP = 0.2 V, VIN = 12 V, VON/OFF = 3.3 V VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V 0.054 0.081 2.5 1.6 0.2 0.2 0.08 0.125 V V A Notes: 1. Range of Vin can be up to 30V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed 20V. 2. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RJA is determined by the user's board design. 3. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%. FDC6330L Load Switch Application External Component Recommendation: For applications where Co 1F. For slew rate control, select R2 in the range of 1k - 4.7k . For additional in-rush current control,C1 1000pF can be added. Select R1 so that the R1/R2 ratio ranges from 10 - 100. R1 is required to turn Q2 off. FDC6330L Rev. C FDC6330L Typical Characteristics (continued) 0.4 0.5 TJ = 125C 0.4 0.3 V DROP (V) TJ = 125C V DROP (V) 0.3 T = 25 C J 0.2 T = 25 C J 0.2 0.1 V IN = 12 V VON/OF F = 1. 5 - 8 V PW =300 us, D 2% 0.1 V IN = 5V VON/OF F = 1. 5 - 8 V PW =300 us, D 2% 0 0 1 2 IL , (A) 3 4 5 0 0 1 2 IL , (A) 3 4 5 Figure 1. Conduction Voltage Drop Variation with Load Current. Figure 2. Conduction Voltage Drop Variation with Load Current. 0.25 IL = 1A VON/OFF = 1.5 - 8 V PW =3 00 us, D 2% 0.2 R(ON) ,(Ohm) 0.15 T = 1 25C J 0.1 0.05 T = 25 C J 0 2 4 6 VI N , (V) 8 10 12 Figure 3. On-Resistance Variation with Input Voltage. TRANSIENT THERMAL RESISTANCE 1 0.5 D = 0.5 r(t), NORMALIZED EFFECTIVE 0.2 0.1 0.05 0.2 0.1 0.05 0.02 0.01 R JA (t) = r(t) * R JA R JA =180C/W P(pk) t1 t2 0.02 0.01 0.0001 Single Pulse TJ - T A = P * R JA (t) Duty Cycle, D = t 1 / t 2 0.001 0.01 0.1 t 1 , TIME (sec) 1 10 100 300 Figure 4.Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 2. Transient themal response will change depending on the circuit board design. FDC6330L Rev. C SuperSOTTM-6 Tape and Reel Data and Package Dimensions SSOT-6 Packaging Configuration: Figure 1.0 Customize Label Antistatic Cover Tape Conductive Embossed Carrier Tape F63TNR Label 631 SSOT-6 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Standard (no flow code) TNR 3,000 7" Dia 184x187x47 9,000 0.0158 0.1440 D87Z TNR 10,000 13" 343x343x64 20,000 0.0158 0.4700 631 631 631 Pin 1 SSOT-6 Unit Orientation 343mm x 342mm x 64mm Intermediate box for D87Z Option F63TNR Label F63TNR Label F63TNR Label sample 184mm x 184mm x 47mm Pizza Box for Standard Option F63TNR Label LOT: CBVK741B019 FSID: FDC633N QTY: 3000 SPEC: Trailer SSOT-6 Tape Leader Configuration: Figure 2.0 D/C1: D9842 D/C2: QTY1: QTY2: SPEC REV: CPN: QARV: (F63TNR)2 Carrier Tape Cover Tape Trailer Tape 160mm minimum Components Leader Tape 390mm minimum (c) 1998 Fairchild Semiconductor Corporation December 1998, Rev. B SuperSOTTM-6 Tape and Reel Data and Package Dimensions, continued SSOT-6 Embossed Carrier Tape Configuration: Figure 3.0 T E1 P0 D0 F K0 Wc B0 E2 W Tc A0 P1 D1 User Direction of Feed Dimensions are in millimeter Pkg type SSOT-6 (8mm) A0 3.23 +/-0.10 B0 3.18 +/-0.10 W 8.0 +/-0.3 D0 1.55 +/-0.05 D1 1.00 +/-0.125 E1 1.75 +/-0.10 E2 6.25 min F 3.50 +/-0.05 P1 4.0 +/-0.1 P0 4.0 +/-0.1 K0 1.37 +/-0.10 T 0.255 +/-0.150 Wc 5.2 +/-0.3 Tc 0.06 +/-0.02 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). 20 deg maximum Typical component cavity center line 0.5mm maximum B0 20 deg maximum component rotation 0.5mm maximum Sketch A (Side or Front Sectional View) Component Rotation A0 Sketch B (Top View) Typical component center line Sketch C (Top View) Component lateral movement SSOT-6 Reel Configuration: Figure 4.0 Component Rotation W1 Measured at Hub Dim A Max Dim A max Dim N See detail AA 7" Diameter Option B Min Dim C See detail AA W3 Dim D min 13" Diameter Option W2 max Measured at Hub DETAIL AA Dimensions are in inches and millimeters Tape Size 8mm Reel Option 7" Dia Dim A 7.00 177.8 13.00 330 Dim B 0.059 1.5 0.059 1.5 Dim C 512 +0.020/-0.008 13 +0.5/-0.2 512 +0.020/-0.008 13 +0.5/-0.2 Dim D 0.795 20.2 0.795 20.2 Dim N 2.165 55 4.00 100 Dim W1 0.331 +0.059/-0.000 8.4 +1.5/0 0.331 +0.059/-0.000 8.4 +1.5/0 Dim W2 0.567 14.4 0.567 14.4 Dim W3 (LSL-USL) 0.311 - 0.429 7.9 - 10.9 0.311 - 0.429 7.9 - 10.9 8mm 13" Dia December 1998, Rev. B SuperSOTTM-6 Tape and Reel Data and Package Dimensions, continued SuperSOTTM-6 (FS PKG Code 31, 33) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.0158 (c) 1998 Fairchild Semiconductor Corporation September 1998, Rev. A TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM GTOTM HiSeCTM DISCLAIMER ISOPLANARTM MICROWIRETM POPTM PowerTrenchTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 TinyLogicTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. |
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